MODEL: SP-360C: Economy smart industrial Computer Interfaced IR / Hot-Air BGA Reballing Station for laptop components repair

Specification: 

FEATURES: 

 
Excellent heating material produces high temperature breeze, precise control of BGA desoldering and welding process.
Adjust hot air flow and temperature greatly, produce high-temperature breeze.Movable heating head, able to move horizontally, easy to operate.The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom  constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA.Touch screen interface, PLC control; real-time temperature profile display, able to  display set profile and practically-tested  profile.Powerful cross flow can cool the lower heating area rapidly.
Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs.The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards.The BGA soldering supporting frame can micro-adjusted to avoid local sinkage.  8 segments liter (drop) and 8 segments constant temperature control, mass storage, temperature setting , profile analysis can be carried out on the touch screenEquipped with over temperature alarming and protection function both upper and lower  heating  area. With sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGAThe integrated design of machine and chassis is room-saving,and the machine can be changed for the instrumentation control according to the need.